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R183-S90-LAD1 - Rack Server - 5th/4th Gen Intel Xeon Scalable - 1U DP 4-Bay Gen4 NVMe/SATA/SAS DLC

• Direct liquid cooling solution • Dual 5th/4th Gen Intel® Xeon® Scalable Processors • Dual Intel® Xeon® CPU Max Series • 8-Channel DDR5 RDIMM, 32 x DIMMs • Dual ROM Architecture • 2 x 1Gb/s LAN ports via Intel® I350-...

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GIGABYTE Product ID: 6NR183S90DR000LBD1

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Specifications
  1. R183-S90-LAD1

Rack Server - 5th/4th Gen Intel® Xeon® Scalable - 1U DP 4-Bay Gen4 NVMe/SATA/SAS DLC

  • Direct liquid cooling solution
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors
  • Dual Intel® Xeon® CPU Max Series
  • 8-Channel DDR5 RDIMM, 32 x DIMMs
  • Dual ROM Architecture
  • 2 x 1Gb/s LAN ports via Intel® I350-AM2
  • 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 1 x FHHL PCIe Gen5 x16 slot
  • 2 x OCP 3.0 Gen5 x16 slots
  • 1+1 1600W 80 PLUS Platinum redundant power supplies

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 815

CPU

5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Memory

32 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Rear side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Front side:
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_0

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRS101J:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_1
Supports NCSI function

Internal I/O

1 x TPM header
1 x VROC connector

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Power Supply

1+1 1600W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings

System Fans

8 x 40x40x56mm (32,000rpm)

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.

Weight

Net Weight: 23.7 kg
Gross Weight: 25.7 kg

Packaging Dimensions

1086 x 588 x 261 mm

Packaging Content

1 x R183-S90-LAD1
1 x CoolIT CPU cold plate loop
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x 2-Section Rail kit

Part Numbers

- Barebone w/ cold plates (5th/4th Gen): 6NR183S90DR000LBD1*
- Barebone w/ cold plates (4th Gen): 6NR183S90DR000LAD1*
- Barebone w/o cold plates (5th/4th Gen): 6NR183S90DZ000LBD1*
- Barebone w/o cold plates (4th Gen): 6NR183S90DZ000LAD1*
- Motherboard: 9AS93FS0UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CoolIT CPU cold plate loop: 25ST7-100009-C4R
- Front panel board - CFP1010: 9CFP1010NR-00
- Backplane board - CBP1047: 9CBP1047NR-00
- Fan module: 25ST2-445650-S1R
- Riser card - CRS101J: 9CRS101JNR-00
- G-SCM board - CDCR112: 9CDCR112NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21600C-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- Leak sensor board: 6NR183S90S1000LAD10
- RMA packaging: 6NR183S90SR-RMA-L100

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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