• Single-Phase Immersion Ready Server • 2U 4-node front access server system • Dual AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) per node • 12-Channel DDR5 RDIMM, 96 x DIMMs • Dual ROM Architecture &b...
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GIGABYTE Product ID: 6NH273Z82DR000IAW1
High Density Server - AMD EPYC™ 9004 - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS Immersion
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
Dimensions (WxHxD, mm)
2U 4-Node - Front access
440 x 87.5 x 877
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor per node, 5nm technology
Up to 128 cores, 256 threads per processor
cTDP up to 400W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 6096
Total:
8 x LGA 6096
Socket SP5
Memory
Per node:
24 x DIMM slots
Total:
96 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management LAN
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
Expansion Slots
Per node:
Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
Optional 1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
Riser Card CRSH01R x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
Optional 4 x M.2 slots (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
Top I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
Operating Properties
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 51.4 kg
Gross Weight: 53.4 kg
Packaging Dimensions
1179 x 700 x 380 mm
Packaging Content
1 x H273-Z82-IAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
Part Numbers
- Barebone package: 6NH273Z82DR000IAW1*
- Motherboard: 9MZ83HD0UR-000
- CPU heatsink: 25ST1-553203-A0R/25ST1-553204-A0R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000K-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 6NH273Z82S1000IAW11 (12-in-1)
- RMA packaging: 6NH273Z82SR-RMA-I100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
• Images on the website may differ from the actual product.
• Published prices in the store are subject to change and may vary based on market conditions and inventory availability.