1. H263-V60-LAW1

High Density Arm Server - NVIDIA Grace™ CPU Superchip - 2U 4-Node 16-Bay Gen5 NVMe DLC

• Direct liquid cooling solution
• High-performance CPU for HPC and cloud computing
• 2U 4-node rear access server system
• NVIDIA Grace™ CPU Superchip
• 900GB/s NVIDIA® NVLink®-C2C Interconnect
• Up to 960GB LPDDR5X ECC memory per module
• Compatible with NVIDIA BlueField®-3 DPUs
• 16 x 2.5" Gen5 NVMe hot-swappable bays
• 8 x M.2 slots with PCIe Gen5 x4 interface
• 4 x FHHL PCIe Gen5 x16 slots
• 4 x OCP 3.0 Gen5 x16 slots
• 2+1 3000W 80 PLUS Titanium redundant power supplies

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 850

Superchip

NVIDIA Grace™ CPU Superchip:
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 500W (CPU + memory)

Memory

Per node:
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
1 x CMC port

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Storage

Per node:
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)

Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)

Expansion Slots

Per node:
PCIe Cable:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards

Total:
PCIe Cable x 4:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4

TPM

1 x TPM header with SPI interface

Power Supply

2+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H263-V60-LAW1
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH263V60MR000LAW1*
- 3-Section Rail kit: 25HB2-A66125-K0R

Optional parts:

- GIGABYTE Superchip cold plate loop: 25H26-3V60000-E43X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.