1. H263-S64-IAW1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node 8-Bay Gen4 NVMe/SATA/SAS Immersion

• Single-Phase Immersion Ready Server
• 2U 4-node front access server system
• Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
• Dual Intel® Xeon® CPU Max Series per node
• 8-Channel DDR5 RDIMM, 64 x DIMMs
• Dual ROM Architecture
• 1 x CMC port
• 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
• 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
• 4 x LP PCIe Gen5 x16 slots
• 4 x OCP 3.0 Gen5 x16 slots
• Dual 3000W 80 PLUS Titanium redundant power supply

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
440 x 87.5 x 840

CPU

5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor per node, TDP up to 350W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel® SATA RAID 0/1

Expansion Slots

Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0 (Optional EDSFF riser card for 2 x EDSFF/M.2 slots)

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0 (Optional EDSFF riser cards for 8 x EDSFF/M.2 slots)

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Top I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC port
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC port, CMC status LED and reset button per system.

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Operating Properties

Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 43.26 kg
Gross Weight: 45.56 kg

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H263-S64-IAW1
8 x CPU heatsinks
24 x Carriers

Part Numbers

- Barebone package (5th/4th Gen): 6NH263S64DR000IBW1*
- Barebone package (4th Gen): 6NH263S64DR000IAW1*
- Motherboard: 9MS63HD1UR-000
- CPU heatsink: 25ST1-25320R-C1R/25ST1-45320F-A0R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000K-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 6NH263S64S1000IAW11
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S64SR-RMA-I100

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.