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H263-S63-LAW1 - High Density Server - 5th/4th Gen Intel Xeon Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W DLC

• Direct liquid cooling solution • 2U 4-node rear access server system • Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node • Dual Intel® Xeon® CPU Max Series per node • 8-Channel DDR5 RDIMM, 64 x DIMMs • Dual...

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GIGABYTE Product ID: 6NH263S63DR000LBW1

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Specifications
  1. H263-S63-LAW1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W DLC

  • Direct liquid cooling solution
  • 2U 4-node rear access server system
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
  • Dual Intel® Xeon® CPU Max Series per node
  • 8-Channel DDR5 RDIMM, 64 x DIMMs
  • Dual ROM Architecture
  • 1 x CMC port
  • 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP 3.0 Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

CPU

5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor per node, TDP up to 385W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel® SATA RAID 0/1

Expansion Slots

Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.

Weight

Net Weight: 47.28 kg
Gross Weight: 51.83 kg

Packaging Dimensions

w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm

Packaging Content

1 x H263-S63-LAW1
4 x CoolIT CPU cold plate loops
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone w/ cold plates (5th/4th Gen): 6NH263S63DR000LBW1*
- Barebone w/ cold plates (4th Gen): 6NH263S63DR000LAW1*
- Barebone w/o cold plates (5th/4th Gen): 6NH263S63DZ000LBW1*
- Barebone w/o cold plates (4th Gen): 6NH263S63DZ000LAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000L-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- GIGABYTE cold plate loop: 25H26-3S62000-E01X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
- RMA packaging: 6NH263S63SR-RMA-L100

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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