1. H262-NO1

HCI Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS

• 2U 4-node rear access server system
• 3rd Gen Intel® Xeon® Scalable Processors
• Dual processor per node, 10nm technology
• 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
• Supports Intel® Optane™ Persistent Memory 200 series
• Dual ROM Architecture
• Intel® C621A Chipset
• 4 x Dedicated management ports
• 1 x CMC port
• 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
• 8 x LP PCIe Gen4 x16 slots
• 4 x OCP 3.0 Gen4 x16 slots
• Dual 2200W 80 PLUS Platinum redundant power supply

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

CPU

3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Chipset

Intel® C621A Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Per node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x CMC port

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel® SATA RAID 0/1/5/10

Expansion Slots

Per node:
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth

Total:
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth

Internal I/O

Per node:
1 x COM header
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP

Weight

Net Weight: 27.8 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-NO1
8 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH262NO1MR-00-1*
- Motherboard: 9MH62HD2NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320S-M1R/25ST1-44320T-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP160: 9CMTP160NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO1SR-RMA-A100

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.