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H253-Z10-AAP1 - High-Density Server - EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe

• 2U 4-node front access server system • Single AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) per node • 12-Channel DDR5 RDIMM, 96 x DIMMs • Dual ROM Architecture • 8 x 1Gb/s LAN ports via Intel® I350-...

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GIGABYTE Product ID: 6NH253Z10DR000AAP1

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Specifications
  1. H253-Z10-AAP1

High-Density Server - AMD EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe

  • 2U 4-node front access server system
  • Single AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) per node
  • 12-Channel DDR5 RDIMM, 96 x DIMMs
  • Dual ROM Architecture
  • 8 x 1Gb/s LAN ports via Intel® I350-AM2
  • 2 x CMC ports
  • 8 x E1.S Gen4 NVMe hot-swappable bays
  • 12 x M.2 slots with PCIe Gen5 x4 and SATA interface
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP 3.0 Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
447 x 86.8 x 902

CPU

AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Single processor per node, 5nm technology
*Up to 128 cores, 256 threads
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Socket

Per Node:
1 x LGA 6096

Total:
4 x LGA 6096

Socket SP5

Memory

Per node:
24 x DIMM slots

Total:
96 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)

LAN

Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management LAN
2 x CMC ports

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
8 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Expansion Slots

Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen5 x4
- Supports 2280/22110 cards

2 x M.2 slots:
- M-key
- SATA via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1

Total:
Riser Card CRSH01Q x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

4 x M.2 slots:
- M-key
- PCIe Gen5 x4
- Support 2280/22110 cards

8 x M.2 slots:
- M-key
- SATA via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1

Internal I/O

Per node:
1 x COM
1 x TPM header

Front I/O

Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs

TPM

1 x TPM header with SPI interface

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 29.4 kg
Gross Weight: 46.8 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H253-Z10-AAP1
4 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH253Z10DR000AAP1*
- Motherboard: 9MZ13SH0UR-000
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- EDSFF riser card - CRSH01X: 9CRSH01XNR-00
- CMC module - CMBH42: 9CMBH42NR-00
- Power supply: 25EP0-23000H-G1S

Optional parts:

- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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