• 2U 4-node front access server system • Single AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) per node • 12-Channel DDR5 RDIMM, 96 x DIMMs • Dual ROM Architecture • 8 x 1Gb/s LAN ports via Intel® I350-...
Click here for availability
GIGABYTE Product ID: 6NH253Z10DR000AAP1
High-Density Server - AMD EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
Dimensions (WxHxD, mm)
2U 4-Node - Front access
447 x 86.8 x 902
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Single processor per node, 5nm technology
*Up to 128 cores, 256 threads
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
Per Node:
1 x LGA 6096
Total:
4 x LGA 6096
Socket SP5
Memory
Per node:
24 x DIMM slots
Total:
96 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management LAN
2 x CMC ports
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Total:
8 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Expansion Slots
Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function
1 x M.2 slot:
- M-key
- PCIe Gen5 x4
- Supports 2280/22110 cards
2 x M.2 slots:
- M-key
- SATA via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1
Total:
Riser Card CRSH01Q x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function
4 x M.2 slots:
- M-key
- PCIe Gen5 x4
- Support 2280/22110 cards
8 x M.2 slots:
- M-key
- SATA via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1
Internal I/O
Per node:
1 x COM
1 x TPM header
Front I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
TPM
1 x TPM header with SPI interface
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 29.4 kg
Gross Weight: 46.8 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H253-Z10-AAP1
4 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH253Z10DR000AAP1*
- Motherboard: 9MZ13SH0UR-000
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- EDSFF riser card - CRSH01X: 9CRSH01XNR-00
- CMC module - CMBH42: 9CMBH42NR-00
- Power supply: 25EP0-23000H-G1S
Optional parts:
- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
• Images on the website may differ from the actual product.
• Published prices in the store are subject to change and may vary based on market conditions and inventory availability.