• CPU+GPU design for giant-scale AI and HPC • 2U 2-node rear access server system • NVIDIA GH200 Grace Hopper Superchip • 900GB/s NVIDIA® NVLink®\-C2C Interconnect • Up to 480GB CPU LPDDR5X ECC memory per module • Up...
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GIGABYTE Product ID: 6NH223V10MR000AAW1
HPC/AI Arm Server - NVIDIA GH200 Grace Hopper Superchip - 2U 2-Node 8-Bay Gen5 NVMe
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87.5 x 850
Superchip
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
NVIDIA Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Hopper GPU:
- Up to 96GB HBM3
or 144GB HBM3e (coming soon)
- Memory bandwidth up to 4TB/s (or 4.9TB/s)
LAN
Per node:
2 x 10Gb/s LAN ports (1 x Intel® X550-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10Gb/s LAN ports (2 x Intel® X550-AT2)
Support NCSI function
2 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
4 x 2.5" Gen5 NVMe hot-swappable bays, from PEX89048
Total:
8 x 2.5" Gen5 NVMe hot-swappable bays, from CPU
Expansion Slots
Per node:
PCIe Cable x 2:
- *1 x PCIe x16 (Gen5 x16) FHHL slot (Dual slot), from CPU
- 1 x PCIe x16 (Gen5 x16) FHHL slot (Single slot), from CPU
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Support 2280/22110 cards
Total:
PCIe Cable x 4:
- *2 x PCIe x16 (Gen5 x16) FHHL slots (Dual slot), from CPU
- 2 x PCIe x16 (Gen5 x16) FHHL slots (Single slot), from CPU
2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function
4 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Support 2280/22110 cards
*When BlueField-3 DPUs are installed, the ambient temperature is limited to 25℃.
Internal I/O
Per node:
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Reset buttons
2 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Total:
4 x USB 3.2 Gen1
2 x Mini-DP
4 x RJ45
2 x MLAN
2 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
TPM
1 x TPM header with SPI interface
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 706 x 306 mm
Packaging Content
1 x H223-V10-AAW1
4 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NH223V10MR000AAW1*
- Motherboard: 9MV13HD0NR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z3-A0R
- Superchip heatsink: 25ST1-2532Z5-A0R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH7O1: 9CBPH7O1NR-00
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- RMA packaging: 6NH223V10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
• Images on the website may differ from the actual product.
• Published prices in the store are subject to change and may vary based on market conditions and inventory availability.