• CPU+GPU Direct liquid cooling solution • Liquid cooled NVIDIA HGX™ H100 with 4 x SXM5 GPUs • 4th-generation NVIDIA® NVLink® 900GB/s • Dual AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) • 12-Channel D...
Click here for availability
GIGABYTE Product ID: 6NG363ZR0DR000LAX1
HPC/AI Server - AMD EPYC™ 9004 - 3U DP HGX™ H100 4-GPU DLC
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
Dimensions (WxHxD, mm)
3U
448 x 130 x 800
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 400W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Front side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear side:
2 x 10Gb/s LAN ports (1 x Broadcom® BCM57416)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
4 x 2.5" Gen5 NVMe/SATA/SAS* hot-swappable bays
4 x 2.5" Gen5 NVMe hot-swappable bays
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1, SATA from CPU_0)
*SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Expansion Slots
Liquid cooled NVIDIA HGX™ H100 with 4 x SXM5 GPUs
Front side:
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89144, support RDMA
(Equipped with full-height brackets)
1 x OCP 3.0 slot on the front side disabled, from CPU_0
1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Internal I/O
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45 (Intel I350)
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x RJ45 (Broadcom BCM57416)
1 x MLAN (optional)
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Weight
Net Weight: 50.44 kg
Gross Weight: 55.2 kg
Packaging Dimensions
1176 x 782 x 295 mm
Packaging Content
1 x G363-ZR0-LAX1
1 x CoolIT CPU cold plate loop
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NG363ZR0DR000LAX1*
- Motherboard: 9MZ83HD1UR-000
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2081: 9CBP2081NR-00
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- OCP card - CNVC171: 9CNVC171NR-00
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00
- Rear I/O board (incl. MLAN chip) - CDB66: 9CDB66NR-00
- PCIe switch board - CPBG901: 9CPBG901NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363ZR0SR-RMA-L100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
• Images on the website may differ from the actual product.
• Published prices in the store are subject to change and may vary based on market conditions and inventory availability.