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GIGABYTE

G292-280 - HPC/AI Server - 3rd Gen Intel Xeon Scalable - 2U DP 8 x PCIe Gen4 GPUs Immersion

• Single-Phase Immersion Ready Server • Supports up to 8 x Dual slot Gen4 GPU cards • 3rd Gen Intel® Xeon® Scalable Processors • Dual processor, 10nm technology • 8-Channel RDIMM/LRDIMM DDR4 per processor, 24 x DIMMs &bull...

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GIGABYTE Product ID: 6NG292280DR000IAP1

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Specifications
  1. G292-280

HPC/AI Server - 3rd Gen Intel® Xeon® Scalable - 2U DP 8 x PCIe Gen4 GPUs Immersion

  • Single-Phase Immersion Ready Server
  • Supports up to 8 x Dual slot Gen4 GPU cards
  • 3rd Gen Intel® Xeon® Scalable Processors
  • Dual processor, 10nm technology
  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 24 x DIMMs
  • Dual ROM Architecture
  • Intel® C621A Chipset
  • 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
  • 1 x Dedicated management port
  • 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 4 x 2.5" SATA/SAS hot-swappable bays
  • 8 x FHFL PCIe Gen4 x16 slots for GPUs
  • 2 x LP PCIe Gen4 x16 slots for add-on cards
  • Dual 3000W 80 PLUS Titanium redundant power supply

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
448 x 87.5 x 800

CPU

3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 4189
Socket P+

Chipset

Intel® C621A Chipset

Memory

24 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Rear side:
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
NCSI function supported

1 x 10/100/1000 management LAN

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)

SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRSG620 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs

Riser Card CRSG621 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs

Riser Card CRSG01A x 2:
1 x PCIe x16 (Gen4 x16) low-profile slot on rear side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on rear side, from CPU_1

- Maximum limitation of GPU card: 285mm (L) x 111.5mm (W) x 39.5mm (H)
- System is validated for population with a uniform GPU model
- Support is not provided for mixed GPU populations

Internal I/O

1 x USB 3.2 Gen1 header
1 x TPM header
1 x VROC connector
1 x Backplane board header

Rear I/O

2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input:
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
- Max 3000W/ 220-240V~
+ 12.2V/ 240A
+ 12Vsb/ 3A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

Operating Properties

Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1133 x 724 x 261 mm

Packaging Content

1 x G292-280
2 x CPU heatsinks

Part Numbers

- Barebone package: 6NG292280DR000IAP1*
- Motherboard: 9MG52G20NR-00
- CPU heatsink: 25ST1-343203-M1R/25ST1-343204-M1R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card - CRSG620: 9CRSG620NR-00
- Riser card - CRSG621: 9CRSG621NR-00
- Riser card - CRSG01A: 9CRSG01ANR-00
- Power supply: 25EP0-23000E-G1S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG292280SR-RMA-I101

* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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